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Non-contact transport device for gripping ultra-thin warped wafers without touching them.
◎ Features 1. Non-contact handling and transport of ultra-thin warped wafers and plate-like bodies 2. Does not damage the wafer 3. Does not leave any dirt ◎ Applications 1. Warped wafers 2. GaSa wafers 3. Ultra-thin wafers 4. Surface-treated wafers
Bernoulli chuck with air consumption reduced to one-third of the conventional amount.
Transport the workpiece non-contact. The air consumption is one-third of the conventional amount. The holding force is strong. It has excellent holding stability.
Bernoulli chuck for non-contact gripping of 1.0mm x 1.0mm square wafer chips.
We have developed a non-contact transfer device for microchips, the "Float Chuck SA-□1.0 type," which handles micro wafer chips ranging from 1.0mm to 15mm without contact. This device generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure via a pressure-type air cushion, allowing small cut wafer chips to be suspended in the air in a non-contact state for handling and storage in trays. It is capable of transporting, flipping, and tilting the chips without contamination, damage, or pad marks. Features: 1. Capable of non-contact handling and storage of micro wafer chips ranging from 1 to 15mm in size. 2. Chips can be retrieved from the tray without contact. 3. No scratches or dirt will be attached to the chips. 4. No pad marks will be left on the chips.
It grips a micro 2.0mm IC wafer chip non-contact.
The "Micro 2.0mm Wafer Chip Non-Contact Chuck" generates negative and positive pressure in the gap between the mu chip and the cushion chamber created on the bottom surface by ejecting gas, allowing for the non-contact gripping and transport of micro 2.0mm square IC mu chips. During chip suction, maintaining parallelism between the working surface and the chip is operationally difficult due to the small gap, so this device is designed with a gas ejection nozzle that efficiently generates negative pressure in the small cushion chamber. ◎ Features 1. Capable of non-contact chucking of 2.0mm chips. 2. Non-contact transport of diced wafer chips. 3. Non-contact retrieval of chips from trays. 4. Non-contact holding allows for flipping and tilting of the chip. ◎ Applications 1. Embedded tag IC chips. 2. Event personnel management tag IC chips. 3. Fine wafer chips. 4. Micro lenses. 5. Micro optical devices.
Non-contact chuck of the vertical gas jet method at the Solar Research Institute.
The "non-contact chuck" of the Solar Research Institute's vertical gas jet method can suspend and transport glass substrates in a non-contact state by ejecting air towards the glass substrate, allowing it to float in mid-air. ● Compatible with a wide variety of workpieces Users come from various industries, including semiconductors, FPD, polarizers, films, optics, electronics, paper, and textiles, with delivery records reaching several hundred. The size of the workpieces ranges from chips/lenses a few millimeters square to glass several meters square, with thicknesses also varying from a few micrometers. The characteristics of the workpieces are diverse, including warped wafers, through-holes, breathable and flexible workpieces, and surface-coated workpieces.
